The Novel Flip Chip Ball Grid Array Design and Challenges to Enable Higher Routing Density and Power Requirement

  • Chee Wai Wong, Chee Kheong Yoon, Seng Hooi Ong
  • Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/emap.2005.1598266

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http://dx.doi.org/10.1109/emap.2005.1598266