Eternal Packages: Liquid Metal Flip Chip Devices

  • Assane Ndieguene, Pierre Albert, Clement Fortin, Valerie Oberson, Julien Sylvestre
  • May 2016, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/ectc.2016.29

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http://dx.doi.org/10.1109/ectc.2016.29