Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs

  • Nauman H. Khan, Syed M. Alam, Soha Hassoun
  • September 2009, Institute of Electrical & Electronics Engineers (IEEE)
  • DOI: 10.1109/3dic.2009.5306579

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http://dx.doi.org/10.1109/3dic.2009.5306579