Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging

Lilan Gao, Hong Gao, Xu Chen
  • Soldering and Surface Mount Technology, September 2015, Emerald
  • DOI: 10.1108/ssmt-10-2014-0018

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http://dx.doi.org/10.1108/ssmt-10-2014-0018

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