What is it about?
The efficiencies of argon (Ar), oxygen (O2) and O2 followed by Ar (O2→Ar) plasma treatments are investigated in terms of contaminant removal and wire bond interfacial adhesion improvement, in order to resolve the “lifted ball bond” issue.
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Why is it important?
The investigation of O2→Ar plasma treatment is still rarely focused in previous literature. Moreover, The observation that wire bond interfacial adhesion improvement after O2→Ar plasma treatment is lower than that with the O2 plasma treatment although it has the highest efficiency in surface contaminant removal also has not been reported on similar studies elsewhere.
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This page is a summary of: Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond application, Soldering & Surface Mount Technology, September 2015, Emerald,
DOI: 10.1108/ssmt-03-2015-0006.
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