Self-aligned flat ultra-thin chip package for flexible circuits

Liang Wang, Maarten Cauwe, Steven Brebels, Walter De Raedt, Jan Vanfleteren
  • Circuit World, November 2013, Emerald
  • DOI: 10.1108/cw-05-2013-0019

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http://dx.doi.org/10.1108/cw-05-2013-0019

The following have contributed to this page: Dr Maarten Cauwe and Dr. Jan Vanfleteren