In–Bi low-temperature SLID bonding for piezoelectric materials

  • Knut E. Aasmundtveit, Trym Eggen, Tung Manh, Hoang-Vu Nguyen
  • Soldering and Surface Mount Technology, April 2018, Emerald
  • DOI: 10.1108/ssmt-10-2017-0034

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http://dx.doi.org/10.1108/ssmt-10-2017-0034

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