Characterisation of Cu/Cu bonding using self-assembled monolayer

  • Maria Lykova, Iuliana Panchenko, Ulrich Künzelmann, Johanna Reif, Marion Geidel, M. Jürgen Wolf, Klaus-Dieter Lang
  • Soldering and Surface Mount Technology, April 2018, Emerald
  • DOI: 10.1108/ssmt-10-2017-0033

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http://dx.doi.org/10.1108/ssmt-10-2017-0033

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