Effects of high current density on lead-free solder joints of chip-size passive SMD components

  • Attila Geczy, Daniel Straubinger, Andras Kovacs, Oliver Krammer, Pavel Mach, Gábor Harsányi
  • Soldering and Surface Mount Technology, April 2018, Emerald
  • DOI: 10.1108/ssmt-10-2017-0032

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http://dx.doi.org/10.1108/ssmt-10-2017-0032

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