Convection vs vapour phase reflow in LED and BGA assembly

  • Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikolajek
  • Soldering & Surface Mount Technology, April 2018, Emerald
  • DOI: 10.1108/ssmt-10-2017-0031

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http://dx.doi.org/10.1108/ssmt-10-2017-0031

The following have contributed to this page: Dr Barbara Dziurdzia