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Study of the oxidation effects on isothermal solidification based high temperature stable Pt/In/Au and Pt/In/Ag thick film interconnections on LTCC substrate ---Duguta Suresh Kumar, Nikhil Suri, P. K. Khanna, and R. P. Sharma
The objective of the presented paper is to determine the oxidized phase compositions of indium lead-free solders during solidification at 190 ° C under room environment with the help of X-ray diffraction (XRD) and Energy dispersive spectroscopy (EDX). Many lead-free solders alloys available oxidizes and have poor wetting properties. The oxidation of pure indium solder foil, Au, Pt, and Ag alloys were identified and investigated, in the process of isothermal solidification based solder joints construction at room environment and humidity. Both EDX and XRD characterization techniques were performed to trace out the amount of oxide levels and variety of oxide formations at solder interface respectively. The paper also aims to report the isothermal solidification technique to provide interconnections to pads on Low temperature co-fired ceramic (LTCC) substrate. It also elaborates advantages of isothermal solidification over...
Micro Thick Films Growth Problems on Low Temperature Cofired Ceramic Substrate in Pre-firing Method --- Duguta Suresh Kumar, N. Suri, P.K.Khanna
Abstract: - The present paper reports on the micro thick film growth problems on Low temperature co-fired ceramic technology. The focused interconnection technique is isothermal solidification to provide, power supply connection for micro heater. In this isothermal solidification process, the diffused amount of material and formation of intermetallic phase molecules depends on the surface growth , grain size of the micro thick films, resultant contact surface area with inter layer, temperature and density gradient between the base layer to solder layer. Surface growths of the silver thick film on LTCC substrate is studied with the help of SEM.