HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes

Sreetama Banerjee, Daniel Bülz, Dmytro Solonenko, Danny Reuter, Carsten Deibel, Karla Hiller, Dietrich R T Zahn, Georgeta Salvan
  • Nanotechnology, April 2017, Institute of Physics Publishing
  • DOI: 10.1088/1361-6528/aa6713

The authors haven't finished explaining this publication. If you are the author, sign in to claim or explain your work.

Read Publication

http://dx.doi.org/10.1088/1361-6528/aa6713

The following have contributed to this page: Professor Dietrich RT Zahn