HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes

Sreetama Banerjee, Daniel Bülz, Dmytro Solonenko, Danny Reuter, Carsten Deibel, Karla Hiller, Dietrich R T Zahn, Georgeta Salvan
  • Nanotechnology, April 2017, Institute of Physics Publishing
  • DOI: 10.1088/1361-6528/aa6713

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The following have contributed to this page: Professor Dietrich RT Zahn