An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations

  • Shaorui Yang, Jianmin Qu
  • Modelling and Simulation in Materials Science and Engineering, August 2014, Institute of Physics Publishing
  • DOI: 10.1088/0965-0393/22/6/065011

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http://dx.doi.org/10.1088/0965-0393/22/6/065011