Publication not explained
This publication has not yet been explained in plain language by the author(s). However, you can still read the publication.
If you are one of the authors, claim this publication so you can create a plain language summary to help more people find, understand and use it.
Read the Original
This page is a summary of: Development of a self-packaged 2D MEMS thermal wind sensor for low power applications, Journal of Micromechanics and Microengineering, July 2015, Institute of Physics Publishing, DOI: 10.1088/0960-1317/25/8/085011.
You can read the full text:
Be the first to contribute to this page