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This page is a summary of: Characterization of local strain/stress in copper through-silicon via structures using synchrotron x-ray microdiffraction, electron backscattered diffraction and nonlinear thermomechanical model, Journal of Micromechanics and Microengineering, July 2015, Institute of Physics Publishing, DOI: 10.1088/0960-1317/25/8/085002.
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