Heat conduction investigation of functionally graded material plates under the exponential heat source load

  • J. H. Tian, K. Jiang
  • Numerical Heat Transfer Part A Applications, July 2017, Taylor & Francis
  • DOI: 10.1080/10407782.2017.1358992

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http://dx.doi.org/10.1080/10407782.2017.1358992