Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review

  • Amit Kumar Singh, Bishnu Prasad Panda, Smita Mohanty, Sanjay Kumar Nayak, Manoj Kumar Gupta
  • Polymer-Plastics Technology and Engineering, July 2017, Taylor & Francis
  • DOI: 10.1080/03602559.2017.1354253

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http://dx.doi.org/10.1080/03602559.2017.1354253

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