Properties of Phenolic-Based Ag-Filled Conductive Adhesive Affected by Different Coupling Agents

  • Li-Ngee Ho, Teng Fei Wu, Hiroshi Nishikawa
  • The Journal of Adhesion, November 2013, Taylor & Francis
  • DOI: 10.1080/00218464.2013.775039

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http://dx.doi.org/10.1080/00218464.2013.775039