The effect of thermal mismatch on the thermal conductance of Al/SiC and Cu/diamond composites

Zhibo Sun, Zhuoran Tian, Lin Weng, Yue Liu, Jingjing Zhang, Tongxiang Fan
  • Journal of Applied Physics, January 2020, American Institute of Physics
  • DOI: 10.1063/1.5133982

The authors haven't finished explaining this publication. If you are the author, sign in to claim or explain your work.

Read Publication

http://dx.doi.org/10.1063/1.5133982

The following have contributed to this page: Tongxiang Fan

In partnership with: