What is it about?
A thermal interfacial resistance measurement technique is developed in this work for metal-polymer junctions, such as the ones commonly found in flexible electronics, semiconductor packages, etc. We describe how to design the experiment to measure the interfacial resistance. We discuss all possible errors that could potentially creep in and also discuss ways to avoid them. We demonstrate our measurement technique by fabricating an experiment using a commonly used flexible PCB substrate (copper-Kapton substrate).
Featured Image
Why is it important?
Bonded metal-polymer interfaces often limit the overall heat transfer in electronics packaging, batteries, and heat recovery systems. Previously reported techniques measure metal-polymer thermal resistance at high pressures, and do not offer a solution to measure the intrinsic metal-polymer thermal interfacial resistance (TIR) of junctions bonded through adhesives, welding, or sputtering. In this work, we report a novel technique to measure the intrinsic TIR of bonded metal-polymer junctions, by employing integrated heaters and sensors. This technique is extendable to sputter-coated, electroplated, or welded metal-polymer interfaces as well as adhesively bonded metal-metal interfaces. Our measurement framework can enable in situ TIR measurements in flexible electronics, batteries, or chip packaging to non-destructively evaluate an interface.
Perspectives
Our thermal interfacial resistance measurement technique opens up a whole new class of measurements that can help flexible electronics, semiconductor packages, etc. Thermal interfacial resistance can be used to monitor electrode/package delamination, quality of the interface, etc. which are critical in electronics packaging. Our technique is developed in a way that makes it easy to incorporate into existing electronic devices. We particularly focused on ensuring that the device under test is not permanently damaged during the thermal testing, so that the interface resistance measurement can be made in situ and potentially in operando.
Manjunath C Rajagopal
Read the Original
This page is a summary of: Intrinsic thermal interfacial resistance measurement in bonded metal–polymer foils, Review of Scientific Instruments, October 2020, American Institute of Physics,
DOI: 10.1063/5.0012404.
You can read the full text:
Contributors
The following have contributed to this page
