The novel chamber hardware design to improve the thin film deposition quality in both 12ʺ (300 mm) and 18ʺ (450 mm) wafers with the development of 3D full chamber modeling and experimental visual technique

M.-H. Liao, C.-H. Chen
  • AIP Advances, January 2013, American Institute of Physics
  • DOI: 10.1063/1.4816437