Modeling of localized reflow in solder/magnetic nanocomposites for area-array packaging

Siyang Xu, Andrea D. Pickel, Anya Prasitthipayong, Ashfaque H. Habib, Michael E. McHenry
  • Journal of Applied Physics, January 2013, American Institute of Physics
  • DOI: 10.1063/1.4793516
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