Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure

Jeffrey C. K. Lam, Maggie Y. M. Huang, Tsu Hau Ng, Mohammed Khalid Bin Dawood, Fan Zhang, Anyan Du, Handong Sun, Zexiang Shen, Zhihong Mai
  • Applied Physics Letters, January 2013, American Institute of Physics
  • DOI: 10.1063/1.4776735
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