Electromigration in Cu(Al) and Cu(Mn) damascene lines

C.-K. Hu, J. Ohm, L. M. Gignac, C. M. Breslin, S. Mittal, G. Bonilla, D. Edelstein, R. Rosenberg, S. Choi, J. J. An, A. H. Simon, M. S. Angyal, L. Clevenger, J. Maniscalco, T. Nogami, C. Penny, B. Y. Kim
  • Journal of Applied Physics, January 2012, American Institute of Physics
  • DOI: 10.1063/1.4711070
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