Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

H. R. Kotadia, A. Panneerselvam, O. Mokhtari, M. A. Green, S. H. Mannan
  • Journal of Applied Physics, January 2012, American Institute of Physics
  • DOI: 10.1063/1.3699359