Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

Suk-Kyu Ryu, Qiu Zhao, Michael Hecker, Ho-Young Son, Kwang-Yoo Byun, Jay Im, Paul S. Ho, Rui Huang
  • Journal of Applied Physics, January 2012, American Institute of Physics
  • DOI: 10.1063/1.3696980
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