Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

Y. C. Liang, W. A. Tsao, Chih Chen, Da-Jeng Yao, Annie T. Huang, Yi-Shao Lai
  • Journal of Applied Physics, January 2012, American Institute of Physics
  • DOI: 10.1063/1.3682484