Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

  • Suk-Kyu Ryu, Tengfei Jiang, Kuan H. Lu, Jay Im, Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Paul S. Ho
  • Applied Physics Letters, January 2012, American Institute of Physics
  • DOI: 10.1063/1.3678020

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http://dx.doi.org/10.1063/1.3678020

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