Micro-scale measurement and modeling of stress in silicon surrounding a tungsten-filled through-silicon via

Ryan P. Koseski, William A. Osborn, Stephan J. Stranick, Frank W. DelRio, Mark D. Vaudin, Thuy Dao, Vance H. Adams, Robert F. Cook
  • Journal of Applied Physics, January 2011, American Institute of Physics
  • DOI: 10.1063/1.3644971
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