An insulating liquid environment for reducing adhesion in a microelectromechanical system

  • Seung-Deok Ko, Jeong Oen Lee, Hyun-Ho Yang, Min-Wu Kim, Yong-Ha Song, Jun-Bo Yoon
  • Applied Physics Letters, September 2011, American Institute of Physics
  • DOI: 10.1063/1.3640228

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http://dx.doi.org/10.1063/1.3640228

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