Highly-enhanced reflow characteristics of sputter deposited Cu alloy thin films for large scale integrated interconnections

Takashi Onishi, Masao Mizuno, Tetsuya Yoshikawa, Jun Munemasa, Masataka Mizuno, Teruo Kihara, Hideki Araki, Yasuharu Shirai
  • Journal of Applied Physics, January 2011, American Institute of Physics
  • DOI: 10.1063/1.3611177
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