Stress evolution in surrounding silicon of Cu-filled through-silicon via undergoing thermal annealing by multiwavelength micro-Raman spectroscopy

W. S. Kwon, D. T. Alastair, K. H. Teo, S. Gao, T. Ueda, T. Ishigaki, K. T. Kang, W. S. Yoo
  • Applied Physics Letters, January 2011, American Institute of Physics
  • DOI: 10.1063/1.3596443
The author haven't yet claimed this publicationThe author haven't yet claimed this publication