Flip chip lamination to electrically contact organic single crystals on flexible substrates

M. Coll, K. P. Goetz, B. R. Conrad, C. A. Hacker, D. J. Gundlach, C. A. Richter, O. D. Jurchescu
  • Applied Physics Letters, January 2011, American Institute of Physics
  • DOI: 10.1063/1.3580610
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