Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint

R. Salenbien, R. Co^te, J. Goossens, P. Limaye, R. Labie, C. Glorieux
  • Journal of Applied Physics, January 2011, American Institute of Physics
  • DOI: 10.1063/1.3573389
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