Effect of bake/cure temperature of an advanced organic ultra low-k material on the interface adhesion strength to metal barriers

Kris Vanstreels, Marianna Pantouvaki, Abdelkarim Ferchichi, Patrick Verdonck, Thierry Conard, Yukiharu Ono, Mihoko Matsutani, Koji Nakatani, Mikhail R. Baklanov
  • Journal of Applied Physics, January 2011, American Institute of Physics
  • DOI: 10.1063/1.3561434
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