Stress control during thermal annealing of copper interconnects

  • C.-C. Yang, C. Witt, P.-C. Wang, D. Edelstein, R. Rosenberg
  • Applied Physics Letters, January 2011, American Institute of Physics
  • DOI: 10.1063/1.3551627

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http://dx.doi.org/10.1063/1.3551627

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