The effect of stress migration on electromigration in dual damascene copper interconnects

A. Heryanto, K. L. Pey, Y. K. Lim, W. Liu, N. Raghavan, J. Wei, C. L. Gan, M. K. Lim, J. B. Tan
  • Journal of Applied Physics, January 2011, American Institute of Physics
  • DOI: 10.1063/1.3531393
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