Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author’s Work

  • D. Sujan, L. Vincent, Y. W. Pok
  • MATEC Web of Conferences, January 2018, EDP Sciences
  • DOI: 10.1051/matecconf/201820201006

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http://dx.doi.org/10.1051/matecconf/201820201006