What is it about?

In this study, response surface methodology (RSM) based on central composite design (CCD) was employed to optimise significant parameters in the synthesis of silver nanoparticles (AgNPs) by chemical reduction method to obtain smaller average particle size for better performance using in conductive ink.

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Why is it important?

The conductive ink is the main core of printed electronics and AgNPs are an alternative for preparation of these inks due to their relatively low cost, high conductivity and good stability in ambient conditions. Generally, after printing a conductive ink onto a substrate, it is thermally sintered at temperatures above 100 °C. Then, a continuous conductive thin film forms upon solvent evaporation. Sintering is the last and necessary stage to obtain the electrical contact between NPs. This high sintering temperature is not usually compatible with the common polymer substrates, such as polyethylene terephthalate (PET) or polycarbonate (PC), which have relatively low glass transition temperatures (Tg). Thus, the development of a sintering process at a lower temperature is required for application on polymeric substrates. In the other hand, since the melting points of metal particles fall drastically with reducing the particle size, it would thus be possible to significantly lower the sintering temperature of AgNPs by reducing the particle size. Therefore, it is very important to synthesize AgNPs with small sizes for application in conductive ink.

Perspectives

This study serves as a novel approach as there are no published reports on the optimisation of significant parameters through statistical experimental design in the synthesis of silver nanoparticles (AgNPs) by reduction of silver nitrate with ethylene glycol as reducing agent and in the presence of PVP as stabilizer.

mina ahani
Amirkabir University of Technology

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This page is a summary of: Optimization of Significant Parameters through Response Surface Methodology in the Synthesis of Silver Nanoparticles (AgNPs) by Chemical Reduction Method , Micro & Nano Letters, May 2017, the Institution of Engineering and Technology (the IET),
DOI: 10.1049/mnl.2017.0118.
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