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Our experimental results confirmed that dual-heatspreader configuration is more efficient in heat dissipation than single-heatspreader configuration for DBR-free semiconductor disk lasers (SDLs). SiC is a promising heatspreader material for high power SDLs. Especially with the access to SiC wafer, it allows wafer-scale fabrication of DBR-free SDLs.
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This page is a summary of: 16 W DBR-free membrane semiconductor disk laser with dual-SiC-heatspreader , Electronics Letters, February 2018, the Institution of Engineering and Technology (the IET),
DOI: 10.1049/el.2018.0101.
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