Cleavable Epoxy Thermoset

What is it about?

All the electronic devices are packaged with polymer thermosets. Once the device becomes non functional, recycling is a monumental task due to the difficulty in removing the thermoset with out destroying the underlying expensive substrates. The epoxy thermoset that we developed could be cleaved and removed from a substrate using inexpensive biomolecule. We were able to demonstrate that the underlying substrate is unaffected upon removal of epoxy thermoset.

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Why is it important?

We used a very simple of disulfide moiety as a cleavable functionality. It must be noted that the disulfide functionality didn't affect the mechanical strength of the thermoset, hence this material could very well be used for packaging electronic devices.