An integrated experimental and theoretical investigation on Cu(hfa)2·TMEDA: structure, bonding and reactivityGiuliano Bandoli, Davide Barreca, Alberto Gasparotto, Roberta Seraglia, Eugenio Tondello, Anjana Devi, Roland A. Fischer, Manuela Winter, Ettore Fois, Aldo Gamba, Gloria Tabacchi
- Physical Chemistry Chemical Physics, January 2009, Royal Society of Chemistry
- DOI: 10.1039/b904145a
A good precursor for the chemical vapor deposition of copper oxides
What is it about?
We synthesized, characterized, and tested a novel precursor for the fabrication of copper and copper oxide materials via Chemical Vapor Deposition. Our joint experimental and theoretical analyses predicted and explained the first fragmentation steps of the precursor in terms of the effects of temperature on the Cu(II)-ligands bonds.
Why is it important?
The main novelty of this work is that we highlighted for the first time how temperature affects the molecular structure of a precursor for CVD experiments. We showed that temperature greatly enhances the oscillations of the metal-ligand bonds in the complex, and that this effect is greater for the weakest metal-ligand bond. This behaviour preludes to bond breaking and plays a key role in the decomposition of the precursor.