The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation

Yongcun Zhou, Yagang Yao, Chia-Yun Chen, Kyoungsik Moon, Hong Wang, Ching-ping Wong
  • Scientific Reports, April 2014, Springer Science + Business Media
  • DOI: 10.1038/srep04779

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http://dx.doi.org/10.1038/srep04779

The following have contributed to this page: Chia-Yun Chen and Professor Chia-Yun Chen