Metrology of cracks in 450-mm silicon wafers

What is it about?

The apparatus for X-ray diffraction imaging (XRDI) of 450-mm diameter wafers, now placed at the ANKA synchrotron radiation source in Karlsruhe, is described in the context of the drive to inspect wafers for plastic deformation or mechanical damage. It is shown that full wafer maps at high resolution can be expected to take a few hours to record. Experiments at the Diamond Light Source, on wafers still in their cassettes, suggest that clean-room conditions may not be necessary for such characterization.

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