What is it about?
This is work was presented as a finalist in the Robert J Melosh Competition at the Duke University in 2000. It is in large based on the previous publication of the lead author.
Featured Image
Why is it important?
Because it explains the deformation mechanism of ultra-high density interconnect structures in microelectronics
Read the Original
This page is a summary of: Finite element modeling of a microelectronic structure under uniform thermal loading, Finite Elements in Analysis and Design, October 2001, Elsevier,
DOI: 10.1016/s0168-874x(01)00077-4.
You can read the full text:
Contributors
The following have contributed to this page