What is it about?
Tantalum is widely used a diffusion barrier in copper-polyimide high-density interconnect structures in microelectronics. In this study, the effect of diffusionally accommodated interfacial sliding on the stress and deformation of these structures are studied. A new sliding contact finite-element is developed.
Featured Image
Why is it important?
Because it explains the deformation mechanism of ultra-high density interconnect structures in microelectronics
Read the Original
This page is a summary of: Effect of diffusionally accommodated interfacial sliding on the stress and deformation in copper/polyimide high density interconnects, Mechanics of Materials, May 1999, Elsevier,
DOI: 10.1016/s0167-6636(99)00003-4.
You can read the full text:
Contributors
The following have contributed to this page
