What is it about?
In this work a comprehensive characterization of the stress, elastic modulus, hardness and adhesion of ALD aluminum oxide (Al2O3) films grown at 110–300 °C is presented. Film stress was analyzed by wafer curvature measurements, elastic modulus by nanoindentation and surface-acoustic wave measurements, hardness by nanoindentation and adhesion by microscratch test and scanning nanowear. The films were also analyzed by ellipsometry, optical reflectometry, X-ray reflectivity and time-of-flight elastic recoil detection for refractive index, thickness, density and impurities.
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Why is it important?
ALD films have potential use in various kinds of protective applications and MEMS/NEMS devices, yet their mechanical properties have remained poorly studied. This paper is filling an important vacancy in knowledge with a systematic and thorough study with a large collaborative effort of several universities and research groups.
Perspectives
The interfacial mechanical properties, such as adhesion, were studied using microscratch testing as well as scanning nanowear testing. My responsibility was the scanning nanowear testing as it is an interesting and emerging technique for the interfacial characterization of thin films.
Mr Jussi Lyytinen
Aalto-yliopisto
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This page is a summary of: Aluminum oxide from trimethylaluminum and water by atomic layer deposition: The temperature dependence of residual stress, elastic modulus, hardness and adhesion, Thin Solid Films, February 2014, Elsevier,
DOI: 10.1016/j.tsf.2013.11.112.
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