Silver oxalate-based solders: New materials for high thermal conductivity microjoining

K. Kiryukhina, H. Le Trong, Ph. Tailhades, J. Lacaze, V. Baco, M. Gougeon, F. Courtade, S. Dareys, O. Vendier, L. Raynaud
  • Scripta Materialia, April 2013, Elsevier
  • DOI: 10.1016/j.scriptamat.2012.12.018

New soldering materials

What is it about?

The decomposition of silver oxalate generates nanoparticles of metallic silver with a high propensity for sintering at low tempertaure under very low contact pressure. These properties are very interesting for soldering electronic dies.

Why is it important?

Dies can be soldered below 300°C with a contact pressure lower than 1 M.Pa. The resulting soldering material displays a thermal conductivity higher than 100 W/m/K.

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http://dx.doi.org/10.1016/j.scriptamat.2012.12.018

The following have contributed to this page: Philippe Tailhades