What is it about?
The decomposition of silver oxalate generates nanoparticles of metallic silver with a high propensity for sintering at low tempertaure under very low contact pressure. These properties are very interesting for soldering electronic dies.
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Why is it important?
Dies can be soldered below 300°C with a contact pressure lower than 1 M.Pa. The resulting soldering material displays a thermal conductivity higher than 100 W/m/K.
Read the Original
This page is a summary of: Silver oxalate-based solders: New materials for high thermal conductivity microjoining, Scripta Materialia, April 2013, Elsevier,
DOI: 10.1016/j.scriptamat.2012.12.018.
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Resources
Copper Nanoparticles Prepared from Oxalic Precursors
Correlation between the morphology of cobalt oxalate precursors and the microstructure of metal cobalt powders and compacts
Cobalt particles prepared from oxalic precursors
Cold compaction of iron powders—relations between powder morphology and mechanical properties: Part I: Powder preparation and compaction
Sponge-like iron particles prepared from oxalic precursors and mechanical properties after compaction.
Cold compaction of iron powders - relations between powder morphology and mechanical properties Part II. Bending tests: results and analysis
Solder paste for highly dissipative power electronic assemblies
Solder paste for highly dissipative power electronic assemblies Kiryukhina, K.; Courtade, F.; Dareys, S.; et al. IEEE Conference: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Location: Barcelona, SPAIN APR 16-18, 2013 2013 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP)
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