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This page is a summary of: Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: Related effects on the matrix micromorphology, nature of intermetallics and tensile properties, Journal of Alloys and Compounds, November 2017, Elsevier,
DOI: 10.1016/j.jallcom.2017.06.329.
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