Stress analyses of high spatial resolution on TSV and BEoL structures

D. Vogel, E. Auerswald, J. Auersperg, P. Bayat, R.D. Rodriguez, D.R.T. Zahn, S. Rzepka, B. Michel
  • Microelectronics Reliability, September 2014, Elsevier
  • DOI: 10.1016/j.microrel.2014.07.098
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http://dx.doi.org/10.1016/j.microrel.2014.07.098

The following have contributed to this page: Professor Dietrich RT Zahn